RKD Elite Etch蚀刻酸解封装置集成了许多的工程创新。采用优质级碳化硅加工的整体式蚀刻头组件具有优异的耐酸性，再加上活性氮气体监测和净化系统这一整体的设计，降低了开封完成后残留在蚀刻头上酸的冒烟情况。选择单片碳化硅也可以缩短升温时间。
RKD Engineering’s Elite Etch incorporates the latest innovations. The etch head is machined from premium grade silicon carbide for its extreme acid and temperature resistance. Coupled with an active nitrogen gas monitoring and purge system, this monolithic design to reduces the fuming of residual acids left on the etch head after each decapsulation process. The silicon carbide etch head enables short heat-up times with high thermal conductivity.
The device hold-down assembly (ram nose) is a pneumatically activated and is designed for a large amount of travel. The ram nose only extends when the safety cover is fully closed to ensure absolute vertical movement. The ram nose secures the sample to the etch head, thus eliminating movement of either the package or its fixturing.
The safety cover is operated manually for safe control of the operation. This guarantees to the operator that the cover has sealed correctly. Acid flow lines and system assemblies are radially symmetrical compression joints which are engineered to eliminate high pressure seal failures.
The Elite Etch is designed to fit comfortably inside of a fume hood while maintaining all necessary safety features. By using a heat exchange system, waste acid is cooled below 90 C to allow the use of a single waste bottle. The Elite Etch uses 3 standard 500 ml bottles which are supplied with the system.
RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchanges.
|Etcher Unit||Height: 300 mm (13 in)|
|Width: 190 mm (7.5 in)|
|Depth: 305 mm (12 in)|
|Bottle Assembly||Height: 254 mm (10 in)|
|Width: 280 mm (11 in)|
|Depth: 127 mm (5 in)|
|Weight||Approx. 16 kg (35 lb)|
|Power Source||90 to 250 VAC, 50 to 60 Hz (4 amp)|
|Acid temp. range||20° to 250° C|
|Acid temp. set point||1° C ± 1% of setting|
|Etch cavity (up to)||22 mm x 22 mm (30 mm diagonal)|
|Choice of Acids||fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid|
|Acid Mix Ratios||(nitric to sulfuric ratios) 9:1, 5:1, 4:1, 3:1, 2:1, 1:1|
|Post Etch Rinse Options||sulfuric acids, fuming nitric acids, mixed acids, or no rinse|
|Etch Times||1 to 1,800 seconds in 1 second increments (1 seconds to 30 minutes) dynamic (real time) adjustments of etch time|
|Etch Temperature Ranges||20° to 90° C (nitric acid), 20° to 250° C (sulfuric acid), 20° to 100° C (mixed acids)|
|Etchant Volume Selection||1 to 6 ml per minute - for all acids & acid mixes|
|Operator Program Storage||100 programs stored to nonvolatile memory|